50 System is specifically designed for flexibility and long term reliability
in high production semiconductor metalization environments.
2000, 2550 and 8550 Sputtering Systems offer the highest degree of process
flexibility in the industry.
offers a complete line of new and refurbished sputtering
systems. What ever your needs are in today's industry, CPA
will see you into the future.
We can custom build
your machine to meet your specifications, with the
quality and dependability you require for your
The Model 9900 is a single-sided
sputtering system designed primarily for applications where only one
side of a substrate requires processing, sputter down" only
system has been designed with maximum thin
film sputtering process flexibility as major objective . . .
for the research and development scientist or production
the CVC is an ideal tool for dependable cost effective
The Perkin-Elmer of
RF Plasma systems for
sputtering and etching
reflect an advanced design concept based on a high
capacity load lock that permits wafer loading without
breaking vacuum in the process chamber.
The Varian system sets the
pace for state-of-the-art wafer sputtering. Check out our complete line of
Varian systems right here.
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Process Apparatus, Inc. email@example.com