9900 Main
Features
Process
Sputtering
Options
Specifications

Single Sided Sputtering is the process which defines the 9900, you can see from this sample sketch the Sputter etch concept of the 9900.



CPA builds the most reliable systems in the industry! In actual on-line production use over the last twelve years in some of the most active and successful fabrication facilities in the world

 

Automatic pallet End chamber and pallets loader/unloaders are also optionally available.


Features

The 9900 System represents the most versatile series of standard Sputtering Systems available. Practically any arrangement of standard components can be assembled to provide an almost limitless set of system configurations. Typical variations include the number of targets, the number and type of pumping system (diffusion or cryopumped high vacuum system), the number and type of power supplies (RF, or DC), with or without load lock, with or without sputter etching, with or without substrate heating, to mention some of the possible standard variations.

Versatility goes beyond process configurations. CPA builds systems with programmable process controllers or 4 button semiautomatic controllers.

(shown on left) 9900 standard Cleanroom Calibration procedure in process.

Cathode Assemblies

Cathode assemblies are 14-7/8" by 4-3/4" and include a water cooled copper backing plate. There are no water-to-vacuum seals. The same cathode assembly is used for DC Magnetron, RF Magnetron, or diode sputtering. The cathode mounts through the top plate (or bottom plate for sputter up systems).

Single Sided Sputtering

As shown on the left, Single Sided Sputtering is the process which defines the 9900, you can see from this sample sketch the Sputter etch concept of the 9900.


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