Up to 28
pallets can be loaded at either end of a 9900 Series System.
Once pallets are loaded and the load-lock chamber is
evacuated, load-lock valves are opened and the system is
pumped down to a preset process vacuum. Pallets are
automatically lowered onto the transfer mechanism and moved
through the process chambers. The 9900 transport is
bi-directional so pallets can be transported back and forth
for sequential or multiple-pass deposition.
The 9900 System represents the
most versatile series of standard Sputtering Systems
available. Practically any arrangement of standard components
can be assembled to provide an almost limitless set of system
configurations. Typical variations include the number of
targets, the number and type of pumping system (diffusion or
cryopumped high vacuum system), the number and type of power
supplies (RF, or DC), with or without load lock, with or
without sputter etching, with or without substrate heating,
to mention some of the possible standard variations.
The 9900 is completely
interlocked for maximum personnel and equipment safety. All
access panels, sputtering doors, chamber pressure switches,
and water flow switches are interlocked to provide protection
for personnel, the system and the wafer load in process.
CPA's 9900 Series operated at better than 95% up-time,
including normal shutdown for target replacement, chamber
cleaning and pump service.
Chambers & Targets
Options include systems for either small batches or large
production runs. Horizontal systems with upward, downward or
double sided sputtering. CPA Sputtering Systems are designed
for easy expansion. Chambers and processes can be readily
added or modified to accommodate new process requirements.
Target sizes can be selected for each system, the 9900 and
9930 is a 15" target. Targets assemblies are available to
Sputter an area up to 12" square. On a 9940 system, Target
sizes of 22", 35", or 50" are available.