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While the wafer handling system
employed in the XM8 is dedicated to either 3", 4", 5" or 6" wafer handling,
wafer size conversion is simple and inexpensive. When it's time for an
upgrade, parts kits may be purchased from Varian to convert your line to
larger wafer diameters. |
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The XM-8 System
employs the individual wafer metallization concept, which is unsurpassed
in producing repeatable films run after run. Each wafer is placed in
precisely the same source-to-substrate geometry resulting in excellent
film quality and reproducibility. Wafer-to-wafer variations commonly
observed in batch processing systems are eliminated.
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Varian's
XM-8 is designed to handle
a variety of substrate geometries. It can be configured to
perform a wide variety of thin film processes including
backside metallization, aluminum alloy, and bubble memory (permalloy)
processes. The highly efficient magnetron source is excellent
for economical deposition of precious metals. |
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The unique wafer handling
mechanism transfers wafers very gently and contributes to high
yields for fragile substrates, such as backlapped silicon and
costly gallium arsenide. The modular system architecture lends
itself to a host of other applications, including ceramic
substrates, e.g., thin film hybrids, thin film resistor
networks, microwave circuits, and in the future, dielectric
materials.
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Control of pumpdown, valving,
wafer transfer, and deposition is provided by a Model 5TI
Process Controller. This Controller is simple, reliable, and
also has a manual control feature to facilitate maintenance and
enable the performance of special processes requiring manual
control.
Gentle,
Reliable Wafer Handling
The XM-8 employs a unique
wafer shuttle system to transfer individual wafers from the
entry load lock to each process station. To ensure
reliability and minimize the chances of costly vacuum leaks
which degrade the quality of sputtered films, the shuttle
mechanism does not use any internal belts, chains, gears, or
dynamic vacuum feedthroughs. Instead, the XM-8 uses a
magnetically coupled drive mechanism for linear translation
of each substrate from station to station. With this
approach, wafers are handled very gently, making the XM-8 the
ideal system for processing fragile substrates such as
gallium arsenide and backlapped silicon.
The Model
XM-8 system features fully automatic cassette-to-cassette wafer
processing, minimizing operator errors and enhancing production yields. |
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