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Excellent Film Quality - VersaMag™ deposition source and
single wafer, cassette-to-cassette horizontal sputtering produce
superior films. |
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Many
Options Available - Choose from DC or RF deposition, RF etch,
substrate heaters, dual gas control for reactive sputtering,
and other options to customize the XM-2000 for your application. |
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The system can use different target materials at adjacent stations
without cross contamination. Since targets can be changed quickly, the
XM2000 is easily reconfigured for applications requiring a different
series of deposited materials. Fast pump-down to base pressure in less
than 90 minutes speeds production.
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Varian's
XM-2000 Cassette-to-Cassette Sputtering System brings enhanced
computer control to the field-proven XM-2000 Sputtering System.
We've added automatic process control with superior diagnostic
capabilities for more efficient deposition and ease of operation.
The XM-2000 can process wafers from 3' to 6" in diameter,
and accommodates odd-size substrates. |
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Process
Versatility - Wide variety of metals can be deposited, using
both reactive and non reactive gases, with superb run-to-run
repeatability and uniformity. Ideal for both R&D and production
applications.
Highly
Flexible - System can deposit metal films on backside as well
as front side of substrates. Adapters allow sputtering on odd-sizes,
pieces, and multiple-size wafers within a single run.
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Fully
Automated - Automatic, touch-screen computer control and straightforward
system design facilitate operation and system maintenance.
Production
Worthiness - Computerized process and diagnostic control, combined
with independently vented and pumped load locks, provide well-monitored
and continuous deposition.
Eliminates
Cross-contamination - Plasma confinement shields physically
isolate process stations and capture precious metals for easy
recovery. The XM2000 uses the single wafer sputtering
concept, processing every wafer identically for repeatable
films, run after run.
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