ADVANCED SYSTEM AUTOMATION

A touch-control CRT microprocessor provides a friendly operator interface to the machine and controls wafer handling and processing. The controller is programmed by a floppy disk for key process parameters such as RF etching, wafer heating, and wafer diagnostic monitoring.


Many Options Available - Choose from DC or RF deposition, RF etch, substrate heaters, dual gas control for reactive sputtering, and other options to customize the XM-2000 for your application.

 

SUPERIOR FILM QUALITY

High deposition rates are provided by up to 3 sputtering modules. This, combined with a small volume load lock and sideways sputtering, yields films of unrivaled purity and morphology.

 

 
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HIGH PERFORMANCE SPUTTERING SYSTEM

The 3290 system sets the pace for state-of-the-art wafer sputtering. This new system is based upon the widely accepted and field-proven design of the acclaimed 3280. It provides significant improvements for even greater performance and reliability.

SYSTEM HIGHLIGHTS:

  • Up to three Quantum deposition stations for extended versatility.
  • Combined Preheat and RF etch station for sequential or simultaneous wafer preconditioning.
  • Vacuum Isolated Preprocess Station (VIPS) for multi-level metal applications.
  • ViaFiTM for 100% step coverage with aluminum alloy films.
  • SECS II host computer interface software.
  • Multipass software permits sequential layering of dissimilar metals for hillock control.

ADDITIONAL SYSTEM FEATURES

The 3290 system utilizes an innovative dual cathode magnetron sputtering source to provide excellent control of film thickness and uniformity on six-inch wafers.

INDIVIDUAL WAFER PROCESSING

The 3290 processes waters individually with a fixed wafer-to-source geometry during all process steps. This assures excellent wafer-to-wafer repeatability. Only the wafer itself is introduced into the deposition chamber, maximizing system cleanliness.

CASSETTE-TO-CASSETTE WAFER HANDLING

Wafers are automatically removed from the cassette, processed serially and replaced in the same cassette by a patented wafer handling system. Each wafer is held vertically throughout all process steps to minimize contamination and enhance yields.

Copyright 2003 - Control Process Apparatus, Inc.  sales@sputteringneeds.com

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