3290 system utilizes an innovative dual cathode magnetron sputtering
source to provide excellent control of film thickness and uniformity
on six-inch wafers.
3290 processes waters individually with a fixed wafer-to-source
geometry during all process steps. This assures excellent wafer-to-wafer
repeatability. Only the wafer itself is introduced into the
deposition chamber, maximizing system cleanliness.
are automatically removed from the cassette, processed serially
and replaced in the same cassette by a patented wafer handling
system. Each wafer is held vertically throughout all process
steps to minimize contamination and enhance yields.