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3190 process wafers individually with a fixed wafer-to-source geometry
during all process steps. Wafers can be heated individually both prior to
and during deposition resulting in repeatable and predictable grain size
and specularity. |
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A CRT touch-panel
programmable controller enables the operator to interface with the system
directly through the screen. By providing all comments via a screen display, a
self-prompting "friendly"
interface is achieved. |
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Dynamic measurement of film resistance for diagnostic control is
integrated with the wafer handling system. New, wide-range eddy current
monitor measures films in the 200A to 30,OOOA thickness range.
Non-contacting sensor preserves wafer integrity. |
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The 3190 cassette-to-cassette sputtering system has
an outstanding track record in the industry due to superior performance and
field-proven reliability. The unique design incorporating
individual wafer processing has been widely accepted and
proven in production lines throughout the world. |
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The 3190 offer automated
cassette-to-cassette processing, eliminating the need for
operator loading or handling of individual wafers. Each wafer
is automatically removed from the cassette, transferred into
the vacuum chamber through a load lock, indexed serially
through four process stations, and then returned to its
original slot in the cassette.
Reduced Particulate
Contamination Enhances Yields
To reduce particulate
generation, all movements in vacuum are minimized, and there
are no movements which cross the plane in which the wafer is
held. Wafers are held vertically at all times and are static
during deposition. This prevents particulate generation and
results in higher yields. |
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High Throughput
The 3180 is capable of producing
high quality metal films on 60 wafers per hour. The 3190 can
achieve a throughput of 90 wafers per hour. Both systems can
maintain these throughputs while depositing one micron films
of aluminum alloys. Depending upon your processing
requirements, throughputs may vary.
Wafer handling and
processing in the 3190 systems are automated by four separate
microprocessors. Communication between the microprocessors
allows the system to process wafers in an efficient and
user-friendly manner, with operator interaction provided by a
touch-panel CRT screen. The system prompts the operator when
to load and unload, and runs unattended between loadings.
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