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Fully Automated, Cassette to Cassette
Sputtering System offer
unexcelled Thin Film
processing
performance and field-proven reliability. |
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Wafer handling and processing in
the 3180 systems are automated by 4 separate microprocessors.
Communication between the microprocessors allows the system to process wafers
in an efficient and user-friendly manner, with operator interaction provided
by a touch-panel CRT screen. The system prompts the operator when to load and
unload, and runs unattended between loadings. |
| 3180 system
configuration includes a substrate preheat module at Process Station 1.
For processes requiring precleaning of silicon wafer substrates for
"native oxide" removal, the preheat module can be replaced with an RF
Sputter Etch Module and its associated 1 kW Power Supply. |
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The 3180 series of high
throughput, cassette-to-cassette sputtering systems has
become the industry standard due to superior performance and
field-proven reliability. Their unique design incorporating
individual wafer processing has been widely accepted and
proven in production lines throughout the world. |
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The 3180 systems are designed so
that up to three sputtering sources can be provided, equipped
with either the same target material, or materials of
different composition for processes requiring sequential
deposition. Each system may also be equipped with an RF
Sputter Etch Module for in-situ substrate cleaning prior to
sputtering. Superior
Film Quality
High deposition rates of
approximately 12,000 A/min for aluminum alloys combined with
close coupling of the wafer to the Conical Magnetron (ConMag'm)
source provide films of unrivaled purity and morphology.
Potential sources of contamination are minimized since only
the wafer itself is loaded into the small volume load lock. |
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Up to 28
pallets can be loaded at either end of a 9900 Series System.
Once pallets are loaded and the load-lock chamber is
evacuated, load-lock valves are opened and the system is
pumped down to a preset process vacuum. Pallets are
automatically lowered onto the transfer mechanism and moved
through the process chambers. The 9900 transport is
bi-directional so pallets can be transported back and forth
for sequential or multiple-pass deposition.
The 3180 offers automated
cassette-to-cassette processing, eliminating the need for
operator loading or handling of individual wafers. Each wafer
is automatically removed from the cassette, transferred into
the vacuum chamber through a load lock, indexed serially
through four process stations, and then returned to its
original slot in the cassette. |
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