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Options include systems for either small
batches or large production runs. Horizontal systems with upward,
downward or double sided sputtering.
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Cathode
assemblies are 14-7/8” by 4-3/4”
and include a water cooled copper backing plate. There are no
water-to-vacuum seals. The same cathode assembly is used for DC
Magnetron, RF Magnetron, or diode sputtering. The cathode mounts through
the top plate (or bottom plate for sputter up systems).
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The Model 9930 is a double-sided
system designed for simultaneous deposition on both sides of
a substrate, it is capable of operating in either a "sputter
down" or "sputter up" or "dual sided" process. Its dual,
opposing cathodes allow high throughput in double-sided
applications. |
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The
Model 9930 is modular and can be easily configured to
fit any process. The 9930 can have as many different
process chambers, substrate heaters or Sputter Etch
chambers as desired. Modules can be located in any
order the process requires. Both systems handle up to
28 pallets in a load; the 12" X 12" usable pallet area
makes changing the size of substrates as easy as
changing pallets. |
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For multi-layer deposition both
DC and RF powered cathodes can be used in the same system.
For simultaneous multi-layer deposition each cathode has a
dedicated power supply. Deposition thickness for each layer
is regulated by transport speed and power. Each power supply
has a separate power controller. For systems using tandem
chambers for different target material or processes, a single
power supply can be switched from cathode to cathode. Any mix
of power can be supplied. |
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